[MWC 2008] Samsung annonce une Puce Décodeur TV Mobile

BARCELONA, Spain--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a leader in advanced semiconductor
technology, unveiled today the S3C4F60, a 65nanometer (nm) single-chip
mobile TV System-on-Chip (SoC) which combines a channel decoder with an
RF chip. Samsung’s new S3C4F60 supports all
worldwide TV standards with respect to frequency range and channel
bandwidth, giving consumers the ability to enjoy real-time news, sports,
weather forecasts, and live entertainment anywhere.

Samsung’s suite of advanced products for
portable consumer applications will be on display at the Mobile World
Congress 2008 in Hall 1, Booth #D33, of the Fira de Barcelona, Montjuic.

“As consumers begin to embrace mobile TV,
mobile service providers and telecommunication carriers will increase
their offerings in a variety of new services aimed at improving customer
retention and building new revenue streams,”
said Yiwan Wong, vice president, Marketing Team, System LSI Division,
Semiconductor Business, Samsung Electronics. “Samsung’s
S3C4F60 is the most advanced mobile TV receiver solution in the market
in providing device manufacturers the flexibility to support the most
popular mobile TV standards and broadcast frequency spectrums around the
world using a single platform.”

Samsung’s new receiver chip supports six
different mobile TV standards and complies with all related
specifications of DVB-H/T (ETSI EN 300 744, EN 302 304, EN 301 192 and
MBRAI); ISDB-T (ARIB-B29/ B31 1/ 3-Seg); T-DMB [Korean
T-DMB, DAB (Eureka-147)]; and DAB/ DAB-IP
standards. The integrated built-in multi-band RF tuner supports VHF III
(174-240 MHz), UHF (470-862 MHz), and L-bands (1350-1750 MHz).

Samsung’s S3C4F60 also offers a significant
boost in mobile performance. By achieving 180 Hz Doppler frequency
performance at DVB-H 16 QAM, 8 K, 2/3 CR, and 1/4 GI, mobile TV products
using the S3C4F60 can achieve perfect reception of digital TV signals,
even inside high-speed trains like the TGV, ICE, or Shinkansen traveling
at speeds of up to 300Km/hour.

Fabricated in Samsung’s advanced 65nm process
and housed in a tiny 5x5mm wafer level chip scale package (WL-CSP) to
minimize the footprint, Samsung’s new S3C4F60
integrates into a single chip a low noise amplifier (LNA), embedded
SRAM, analog-to-digital converter (ADC), PLL, CPU (ARM 7) and a low
drop-out (LDO), thereby greatly reducing the number of external
components needed.

According to the market research firm Strategic Analytics, the mobile TV
market is expected to reach 24 million units in 2008 and 133 million
units by 2011, for a compounded annual growth rate of 67 percent.

Samsung’s S3C4F60 is scheduled for mass
production in the third quarter of 2008 and samples will be available
from March 2008.